On 28th June 2013, the inaugural RADWIN Technology Conference took place at the Intercontinental Singapore. This conference was sponsored by Infracomms and supported by RADWIN and Stellent Networks.

RADWIN is the leading global provider of wireless Point-to-Point and Point-to-MultiPoint Solutions in the sub-6GHz space. RADWIN’s solutions are utilised in over 140 countries. They are used in the private sector to boost network capacity and in public safety agencies worldwide for video surveillance. They are part of the RAD group, Israel’s largest telecommunications group. 

Stellent Solutions is founded by a team of specialists with more than 50 years of combined experience in the field of telecommunications and environmental engineering, business management, technical support and consultancy. A test and measurement solutions provider, they offer an extensive range of testing solutions from EXFO, Fitel, Aeroflex, Giga-tronics, Pendulum and Spectracom.

This conference is attended by 40 delegates from the Ministry of Defence, ST Electronic, ST Engineering, Soonpoh, EXFO, Omega, AXS, Nexwave, Partech, NEC, NCS and other significant stakeholders in the communications industry.

There were four main sessions held during the conference. Session 1, 2 and 4 were regarding RADWIN Solutions for Vertical Markets, RADWIN Mobility Solutions and RADWIN Solutions for Carriers & Service Providers respectively. They were conducted by the General Manager of RAWIN APAC, Mr Maurice Illouz. Session 3 was conducted by Mr Joseph Tan, Application Engineer of EXFO on the topic of Test Solutions from Stellent Networks.

We thank the support of RADWIN and Stellent Networks for jointly organising this conference with us. Also, we thank our customers for their unwavering support and for being great participants during the conference.

This inaugural event marks the start of more conferences brought to you by Infracomms, RADWIN and Stellent Networks.